In the early days it’s unlikely that anyone would have purchased clone connectors for end user consumption, indeed I recall fruitless attempts to try to source some 20 or more years ago, Mini-PV was obtainable, but too expensive for me at the time. Unfortunately this made contacts and housings incompatible with the original type. The contacts are enlarged to allow for cheaper and easier bending. The design of the newer clones is quite different, with the contact being stamped from a single piece of brass. Harwin M20 is a product line from a well known manufacturer – they may be the original creator however I’ve not confirmed it. I’ve not been able to establish the first manufacturer the original copies of the Mini-PV design. ![]() I don’t have any proof of this date range, this is based purely on observation having dismantled copious amounts of vintage computer equipment. It appears to be around this time that the first “DuPont” clones appeared. In the early to mid 1990s someone, somewhere worked out that there was a market for a connector very much like Mini-PV, but cheaper. It must be a matter of timing… Enter the clones Berg / du Pont “Mini-PV” (left) connectors next to common clone type (right) from unknown manufacturer. Adding further confusion to the picture, “Berg connector” was already an established vernacular term by that point. Plate from a likely early 1980s vintage Mini-PV crimp toolįor most of its existence, Berg was a division of du Pont, giving us the first (albeit cryptic) clue as to the origin of this term. To piece the story together, the easiest way is to look at the identification plates on historic crimp tools. Why didn’t this name also become associated with the more modern clone type connectors? The vintage computing community often refers to Mini-PV connectors as “Berg” connectors. ![]() It was them who introduced the Mini-PV connector in the 1950s which looks very similar the connectors we call “DuPont” connectors, and is the first type of its kind. The company we have to start with is Berg Electronics, originally based in New Cumberland, Pennsylvania. ![]() I may now finally have connected the dots. The answer to this question unfortunately lives a long time in the past, perhaps 30 years ago, isn’t written down anywhere making it quite difficult to dig out. Designed to overcome our customers’ most difficult challenges, such as voiding and throughput, Solderon™ products feature:ĭuPont Electronics & Imaging leads the way with low-alpha materials by offering tin with low-alpha-particle-emitting versions of our products, which are ideal for packaging applications sensitive to the effects of these emissions.It’s a question many (including myself) have asked, and despite having written about these for years, haven’t been able to offer anything more than a vague explanation. A variety of formulations including tin-silver alloys, pure tin, and indium materials meet a range of process temperatures and melting points, suiting both high- and low-temperature processing needs. Our lead-free, single-step plating materials are specifically designed for the most challenging advanced wafer-level packaging applications. ![]() Production-proven Electroplating Chemistries for Wafer Level PackagingĭuPont Electronics and Imaging’s award-winning Solderon™ BP electroplating chemistries are reliable alternatives to tin-lead alloys for all wafer bumping applications, from standard C4 solder bumps to capping fine-pitch Cu µpillars.
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